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Products application

Thin film photovoltaic
Flat display industry
Low-e glass industry
Optical coating industry
Tools coating industry
Semiconductor industry
Rare-Earth Permanent industry
Electrochromis industry
current location:Home > Products application > Semiconductor industry
     Semiconductor produce process include crystal circle making,crastal circle testing,chip packing and ending test .after encapsulation,its need a series of other process.such as:Post Mold Cure、Trim&Form、Plating and printing process etc. Typical encapsulation process is scribing/Loading/ bonding/Sealing/edging / electroplating/printing/ tendon-cut and molding/ inspection/testing/shipping.In the whole manufacturing ,  sputtering process was existed in Crystal making and chip packaging.

     APG in Semiconductor  indusrty to provide target material basically has:

Type ltem Descripetion Purity Technology
Purity-Targets Cu
 acc. your require 99.99% melting
Ti
 99.99%
 melting、CIP
W
 99.99%
 sintering、HIP
SS
melting
Al
 99.99%
 melting
Si
 99.99%
 pulled crystal+spraying+sintering
Mo 99.99%
 sintering
Cr
 99.99%
 HIP、spraying
Ta
 99.99%
 melting
Ag 99.99%
 melting
Pt
 99.9%
 melting
Ir
 99.99%
 melting
Sc
 99.95%
 melting
In
 99.99%
 cast
Aolly-Targets
 AlSc
 99.8%-99.99%
 sintering
NiFe
 99.9%-99.999%
 spraying
NiCr
 99.95%
 melting、spraying
NiCu
 99.95%
 melting
NiV
 99.95%
 melting
WTi
 99.9%
 melting、spraying
Evaporation material

Cu、Ti、W、Al、Mo、Cr、Ta、Ag、Au、Pt、Ir、Y